Silicon Centric A.I. Enabling
eYs3D offers silicon based solutions for A.I./M.L. Vision. symbiosis of Cloud-Edge &
End-Point, Silicon & Microsystems.
Monetization of Silicon v.s. Longtail Market
AI growth doubling
every 3~4 month
Data Starts to evolve
from 2d to 3d and more
Longtail IoT and new
consumer product hunger
for the right chip.
Neurological Passive 3D Sensing Technology was originated
from the Active Stereo Methodology
Heterogeneous Integrated Product Combination to enable domain
specific & emerging IoT products with versitile solutions.
Enables AI&ML Computer Vision’s potential with system and silicon level integrative innovation. Offers the most cost effective, energy effient & maximized functional performances.
Value Added Partners