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Silicon Centric A.I. Enabling

eYs3D offers silicon based solutions for A.I./M.L. Vision. symbiosis of Cloud-Edge &
End-Point, Silicon & Microsystems.

Monetization of Silicon v.s. Longtail Market

AI growth doubling
every 3~4 month

Data Starts to evolve
from 2d to 3d and more

Longtail IoT and new

consumer product hunger

for the right chip.

Silicon development
becomes expensive

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Visual Perception

For A.I.

Neurological Passive 3D Sensing Technology was originated
from the Active Stereo Methodology

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Products

Heterogeneous Integrated Product Combination to enable domain

specific & emerging IoT products with versitile solutions.

Silicon 4.0

Enables AI&ML Computer Vision’s potential
with system and silicon level integrative
innovation. Offers the most cost effective,
energy effient & maximized functional
performances.

Heterogeneous
Integration

 

Value Added Partners

 

Support

Resource Center

© 2020 by eYs3D Microelectronics, Co.